Packaging using MEMS technologies and planar components

Author

Takahashi, Kazuaki ; Sangawa, Ushio ; Fujita, Suguru ; Goho, Kenji ; Urabe, Takeharu ; Ogura, Hiroshi ; Yabuki, Hiroyuki

Author_Institution

Matsushita Electr. Inst. Tokyo Inc., Matsushita Electr. Ind. Co. Ltd., Kawasaki, Japan

fYear

2000

fDate

2000

Firstpage

904

Lastpage

907

Abstract

Three-dimensional millimeter-wave IC applying multi-layer BCB thin film and silicon micromachining technology was developed. Low loss characteristics were achieved by applying micromachining technology, despite being a quasi-planar structure, and a K-band filter was developed. Moreover, manufacture of the receiver front-end with built-in filter integrated into one package was realized by using flip-chip bonding techniques. Furthermore, we proposed an alternative BCB suspended structure and demonstrated a Ka-band antenna for the proposed package

Keywords

flip-chip devices; integrated circuit packaging; micromachining; micromechanical devices; millimetre wave integrated circuits; K-band filter; Ka-band antenna; MEMS packaging technology; Si; flip-chip bonding; loss; multilayer BCB thin film; planar component; quasi-planar structure; receiver front-end; silicon micromachining; suspended structure; three-dimensional millimeter-wave IC; Bonding; Components, packaging, and manufacturing technology; Filters; K-band; Micromachining; Micromechanical devices; Millimeter wave technology; Packaging; Semiconductor thin films; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2000 Asia-Pacific

Conference_Location

Sydney, NSW

Print_ISBN

0-7803-6435-X

Type

conf

DOI

10.1109/APMC.2000.925975

Filename

925975