DocumentCode :
313583
Title :
Assembling engineering knowledge in a modular multi-layer perceptron neural network
Author :
Jansen, W.J. ; Diepenhorst, M. ; Nijhuis, J.A.G. ; Spaanenburg, L.
Author_Institution :
Dept. of Comput. Sci., Groningen Univ., Netherlands
Volume :
1
fYear :
1997
fDate :
9-12 Jun 1997
Firstpage :
232
Abstract :
The popular multilayer perceptron (MLP) topology with an error-backpropagation learning rule doesn´t allow the developer to use the (explicit) engineering knowledge as available in real-life problems. Design procedures described in literature start either with a random initialization or with a `smart´ initialization of the weight values based on statistical properties of the training data. This article presents a design methodology that enables the insertion of pre-trained parts in a MLP network topology and illustrates the advantages of such a modular approach. Furthermore we will discuss the differences between the modular approach and a hybrid approach, where explicit knowledge is captured by mathematical models. In a hybrid design a mathematical model is embedded in the modular neural network as an optimization of one of the pre-trained subnetworks or because the designer wants to obtain a certain degree of transparency of captured knowledge in the modular design
Keywords :
backpropagation; engineering computing; knowledge acquisition; multilayer perceptrons; MLP network topology; engineering knowledge assembly; error-backpropagation learning rule; modular multilayer perceptron neural network; optimization; smart initialization; statistical properties; Artificial neural networks; Assembly; Biological neural networks; Intelligent networks; Knowledge engineering; Mathematical model; Multi-layer neural network; Multilayer perceptrons; Network topology; Neural networks;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Neural Networks,1997., International Conference on
Conference_Location :
Houston, TX
Print_ISBN :
0-7803-4122-8
Type :
conf
DOI :
10.1109/ICNN.1997.611670
Filename :
611670
Link To Document :
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