DocumentCode
3137041
Title
Low-cost realization of ISM Band Pass Filters using integrated combline structures
Author
Son, M.H. ; Kim, Y.J. ; Lee, S.S.
Author_Institution
Samsung Electron. Co. Ltd., Suwon City, South Korea
fYear
2000
fDate
2000
Firstpage
1294
Lastpage
1297
Abstract
The low-cost realization of ISM Band Pass Filters using integrated combline structures has demonstrated. For the low-cost realization and mass-production, efforts have been concentrated into realizing the combline filter structures as an integrated conductor layer of FR5/Epoxy based multi-layer substrates which are widely utilized as multilayer printed circuit boards (PCB) instead of ceramic. This filter is useful for the wireless network devices of ISM band (2.4 GHz) as Bluetooth and Wireless LAN
Keywords
UHF filters; band-pass filters; comb filters; 2.4 GHz; Bluetooth; ISM band; R5/epoxy multilayer substrate; band pass filter; conductor layer; integrated combline structure; printed circuit board; wireless LAN; wireless network device; Band pass filters; Ceramics; Cities and towns; Conducting materials; Costs; Couplings; Electronic mail; Printed circuits; Resonator filters; Transmission line theory;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2000 Asia-Pacific
Conference_Location
Sydney, NSW
Print_ISBN
0-7803-6435-X
Type
conf
DOI
10.1109/APMC.2000.926071
Filename
926071
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