The construction of an embedded vision processing platform for simple automatic die-bonding system

This paper designs an embedded vision processing platform for simple automatic die-bonding system by using ARM microprocessor as the vision processor, Linux as the operation system and USB camera for image acquisition equipment to complete wafer image acquisition, processing, wafer alignment and defects inspection. After the hardware platform is constructed and the software design is implemented, experimental results show that the platform has good vision processing features in real-time, simplicity and efficiency. The platform is competent for wafer image processing and analysis in die bonders and can be widely applied in the field of industry measurement and control.