DocumentCode
3138667
Title
FeCo coating on SmCo5 nanochips by a sonochemical method
Author
Poudyal, N. ; Elkins, K.E. ; Gandha, K.H. ; Liu, J.
Author_Institution
Phys., Univ. of Texas at Arlington, Arlington, TX, USA
fYear
2015
fDate
11-15 May 2015
Firstpage
1
Lastpage
1
Abstract
Sonomechanical synthesis method is used in this study to deposit soft magnetic FeCo coating on hard magnetic SmCo5 nanochips. The hard magnetic nanochips are prepared by surfactant-assisted high-energy ball milling. SEM, EDX, and XRD are used for structural and elemental analysis of the core-shell nanocomposites. Magnetic measurement results show that an increase in FeCo content leads to an increase in saturation magnetization while the coercivity decreases with increasing soft phase content. An enhanced remanence is observed which indicates the exchange coupling between the soft and hard magnetic phases of the nanocomposite. It is also shown that the apparent difference of the magnetic hysteresis loops and XRD patterns measured parallel and perpendicular to the aligning field direction suggests strong magnetic anisotropy.
Keywords
X-ray chemical analysis; X-ray diffraction; ball milling; coatings; cobalt alloys; coercive force; core-shell nanostructures; exchange interactions (electron); iron alloys; magnetic anisotropy; magnetic hysteresis; nanocomposites; nanofabrication; nanomagnetics; permanent magnets; remanence; samarium alloys; scanning electron microscopy; soft magnetic materials; EDX; FeCo-SmCo5; Magnetic measurement; SEM; coercivity; core-shell nanocomposites; elemental analysis; exchange coupling; hard magnetic nanochips; magnetic anisotropy; magnetic hysteresis loops; remanence; saturation magnetization; soft magnetic coating; sonomechanical synthesis; structural analysis; surfactant-assisted high-energy ball milling; Coatings; Magnetic cores; Magnetic resonance imaging; Magnetosphere; Perpendicular magnetic anisotropy; Soft magnetic materials;
fLanguage
English
Publisher
ieee
Conference_Titel
Magnetics Conference (INTERMAG), 2015 IEEE
Conference_Location
Beijing
Print_ISBN
978-1-4799-7321-7
Type
conf
DOI
10.1109/INTMAG.2015.7157449
Filename
7157449
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