DocumentCode :
3138667
Title :
FeCo coating on SmCo5 nanochips by a sonochemical method
Author :
Poudyal, N. ; Elkins, K.E. ; Gandha, K.H. ; Liu, J.
Author_Institution :
Phys., Univ. of Texas at Arlington, Arlington, TX, USA
fYear :
2015
fDate :
11-15 May 2015
Firstpage :
1
Lastpage :
1
Abstract :
Sonomechanical synthesis method is used in this study to deposit soft magnetic FeCo coating on hard magnetic SmCo5 nanochips. The hard magnetic nanochips are prepared by surfactant-assisted high-energy ball milling. SEM, EDX, and XRD are used for structural and elemental analysis of the core-shell nanocomposites. Magnetic measurement results show that an increase in FeCo content leads to an increase in saturation magnetization while the coercivity decreases with increasing soft phase content. An enhanced remanence is observed which indicates the exchange coupling between the soft and hard magnetic phases of the nanocomposite. It is also shown that the apparent difference of the magnetic hysteresis loops and XRD patterns measured parallel and perpendicular to the aligning field direction suggests strong magnetic anisotropy.
Keywords :
X-ray chemical analysis; X-ray diffraction; ball milling; coatings; cobalt alloys; coercive force; core-shell nanostructures; exchange interactions (electron); iron alloys; magnetic anisotropy; magnetic hysteresis; nanocomposites; nanofabrication; nanomagnetics; permanent magnets; remanence; samarium alloys; scanning electron microscopy; soft magnetic materials; EDX; FeCo-SmCo5; Magnetic measurement; SEM; coercivity; core-shell nanocomposites; elemental analysis; exchange coupling; hard magnetic nanochips; magnetic anisotropy; magnetic hysteresis loops; remanence; saturation magnetization; soft magnetic coating; sonomechanical synthesis; structural analysis; surfactant-assisted high-energy ball milling; Coatings; Magnetic cores; Magnetic resonance imaging; Magnetosphere; Perpendicular magnetic anisotropy; Soft magnetic materials;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Magnetics Conference (INTERMAG), 2015 IEEE
Conference_Location :
Beijing
Print_ISBN :
978-1-4799-7321-7
Type :
conf
DOI :
10.1109/INTMAG.2015.7157449
Filename :
7157449
Link To Document :
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