• DocumentCode
    3138815
  • Title

    A scalable simulation framework for evaluating thermal management techniques and the lifetime reliability of multithreaded multicore systems

  • Author

    Hsieh, Ming-Yu

  • Author_Institution
    Sandia Nat. Labs., Scalable Comput. Archit. Organ., Albuquerque, NM, USA
  • fYear
    2011
  • fDate
    25-28 July 2011
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    It has become increasingly challenging to understand supercomputers behavior and performance as they grow. New hurdles in scalability, programmability, power consumption, reliability, cost, and cooling are emerging. This paper introduces the integrated power, area, temperature, reliability modeling framework in the open, modular, multiscale, parallel Structural Simulation Toolkit (SST) to help evaluate new technologies and guide design of future computers. In this study, the simulation framework is used to evaluate different dynamic thermal management techniques, in terms of power, temperature and reliability, on multicore systems running multithreaded and more irregular applications. Simulation results shed some new light on application-aware, performance/power efficient thermal and reliability management policies of multithreaded multicore systems.
  • Keywords
    multi-threading; multiprocessing systems; parallel machines; power aware computing; power consumption; reliability; thermal management (packaging); lifetime reliability; multithreaded multicore systems; power consumption; reliability management policies; scalable simulation framework; structural simulation toolkit; supercomputers; thermal management techniques; Computational modeling; Libraries; Mathematical model; Multicore processing; Power demand; Reliability; Thermal management; multicore system; power management; reliability; simulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Green Computing Conference and Workshops (IGCC), 2011 International
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    978-1-4577-1222-7
  • Type

    conf

  • DOI
    10.1109/IGCC.2011.6008574
  • Filename
    6008574