Title :
Liquid cooling for 3D-ICs
Author :
Shi, Bing ; Srivastava, Ankur
Author_Institution :
Univ. of Maryland, College Park, MD, USA
Abstract :
This paper investigated micro-channel based liquid cooling in 3D-ICs. Specifically, the structure of 3D-IC with micro-channels, and its thermal/hydrodynamic modeling are studied. Also, the design challenges of micro-channel heat sinks in 3D-IC are summarized.
Keywords :
heat sinks; thermal management (packaging); three-dimensional integrated circuits; 3D-IC; hydrodynamic modeling; liquid cooling; microchannel heat sink; thermal modeling; Equations; Heat sinks; Heat transfer; Heating; Mathematical model; Solids;
Conference_Titel :
Green Computing Conference and Workshops (IGCC), 2011 International
Conference_Location :
Orlando, FL
Print_ISBN :
978-1-4577-1222-7
DOI :
10.1109/IGCC.2011.6008576
