DocumentCode
3139194
Title
New Embedded Core Testing for System-on-Chips and System-in-Packages
Author
Wang, Yuxin ; Margala, Martin
Author_Institution
Dept of Electr. & Comput. Eng., Rochester Univ., NY
fYear
2006
fDate
38838
Firstpage
1897
Lastpage
1900
Abstract
Modern system-on-chip (SOC) and system-in-package (SiP) devices, together with deep submicron geometries, challenge the ability of traditional test methodologies. The accessibility to core terminals becomes critical, since direct physical access to some deeply embedded cores from chip pins is prohibitive or very complex. This paper presents a short survey of state-of-the-art test access mechanisms (TAM) and proposes a novel TAM scheme. The novel scheme is based on a concept of radio-on-chip technology. Specifically, by integrating very short-range low-power low cost (area) wireless network with embedded cores, the accessibility and transport capacity for test data and test response can be significantly improved. Simulation results based on test control distribution and resource partition are provided
Keywords
integrated circuit testing; logic testing; radio access networks; radiofrequency integrated circuits; system-in-package; system-on-chip; deep submicron geometries; embedded core testing; radio-on-chip technology; state-of-the-art test access mechanisms; system-in-packages; system-on-chips; very short-range low-power low cost wireless network; Bandwidth; Costs; Geometry; Integrated circuit testing; Logic design; Logic testing; Pins; System testing; System-on-a-chip; Wireless networks; Access Mechanisms; Embedded Core Testing; Radio-on-chip; SOC; SiP;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical and Computer Engineering, 2006. CCECE '06. Canadian Conference on
Conference_Location
Ottawa, Ont.
Print_ISBN
1-4244-0038-4
Electronic_ISBN
1-4244-0038-4
Type
conf
DOI
10.1109/CCECE.2006.277352
Filename
4054806
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