DocumentCode :
314098
Title :
Low pressure encapsulated resonant structures excited electrostatically
Author :
Corman, Thierry ; Enoksson, Peter ; Stemme, Göran
Author_Institution :
Dept. of Signals Sensors & Syst., R. Inst. of Technol., Stockholm, Sweden
Volume :
1
fYear :
1997
fDate :
16-19 Jun 1997
Firstpage :
101
Abstract :
Low pressure encapsulated resonant structures were built with a cavity pressure of 1 mbar, obtained and measured for several structures bonded anodically to glass lids with different recess depths from 20.5 to 44 μm. The same pressure has also been demonstrated for structures with integrated electrodes for electrostatic excitation and capacitive detection. No getter material or gas evacuation procedure was used. No leakage has been observed and measurements indicate 1 mbar and the same Q-values after six months storage. A theoretical model for the squeeze-film Q-factor taking into account both the pressure and the recess depth is also presented
Keywords :
Q-factor; electrostatic devices; encapsulation; micromechanical resonators; semiconductor device packaging; 1 mbar; 20.5 to 44 mum; Q-values; Si; anodic bonding; capacitive detection; cavity pressure; electrostatic excitation; glass lids; integrated electrodes; low pressure encapsulated resonant structures; recess depth; silicon resonator; squeeze-film Q-factor; theoretical model; Bonding; Electrodes; Electrostatic measurements; Gettering; Glass; Pressure measurement; Q factor; Resonance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-3829-4
Type :
conf
DOI :
10.1109/SENSOR.1997.613592
Filename :
613592
Link To Document :
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