Title :
Novel packaging technique and its application to a wet/wet differential pressure silicon sensor
Author :
Krassow, H. ; Heimlich, D. ; Campabadal, F. ; Lora-Tamayo, E.
Author_Institution :
Centro Nacional de Microelectron., CSIC, Barcelona, Spain
Abstract :
The packaging technique presented provides direct interaction between the sensing element and the physical or chemical variable to be measured as well as hermetic insulation and mechanical protection of the silicon sensor and its electrically active components. Unlike application specific packaging methods, it therefore can potentially be applied to a variety of microelectronic sensors
Keywords :
elemental semiconductors; microsensors; photolithography; pressure sensors; semiconductor device packaging; silicon; Si; hermetic insulation; mechanical protection; microelectronic sensors; packaging technique; wet/wet differential pressure sensor; Chemical elements; Chemical sensors; Dielectrics and electrical insulation; Electric variables measurement; Mechanical sensors; Mechanical variables measurement; Microelectronics; Packaging; Protection; Silicon;
Conference_Titel :
Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-3829-4
DOI :
10.1109/SENSOR.1997.613637
