Title :
Integrated sensor wafer-level packaging
Author :
Audet, Sarah A. ; Edenfeld, Katrina M.
Author_Institution :
Adv. Interconnect Syst. Lab., Motorola Inc., Tempe, AZ, USA
Abstract :
Low cost packaging for integrated sensor devices is key to the ingress of silicon sensors into the consumer and industrial marketplace. Wafer-level packaging for integrated sensors can be performed using several technologies. The benefits and challenges of several these technologies are described
Keywords :
CMOS integrated circuits; elemental semiconductors; glass; microsensors; silicon; wafer bonding; 10 to 25 mum; CMOS; CVD; MEMS; Si; Si sensors; consumer electronics; frit glass; industrial electronics; integrated sensor wafer-level packaging; low cost packaging; CMOS process; Contamination; Glass; Inorganic materials; Lead; Packaging; Silicon; Temperature sensors; Wafer bonding; Wafer scale integration;
Conference_Titel :
Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-3829-4
DOI :
10.1109/SENSOR.1997.613640
