• DocumentCode
    3141395
  • Title

    Active Microgripper Interface Used in Microassembly of MEMS

  • Author

    Anis, Yasser H. ; Mills, James K. ; Cleghorn, William L.

  • Author_Institution
    Dept. of Mech. & Ind. Eng., Toronto Univ.
  • fYear
    2006
  • fDate
    38838
  • Firstpage
    352
  • Lastpage
    354
  • Abstract
    This paper describes the design of an active microgripper interface used in the assembly of three-dimensional MEMS (micro electromechanical systems) microstructures. The interface connects a robotic manipulator to a 3-pad active microgripper. Electric current is transmitted to the interface by bonding its pads to the robotic manipulator using standard tungsten probes. The interface is integrated with a hinged microstructure that is rotated by a 170deg angle causing the hinge plane to get in contact with the interface small pads. The interface, bonded to the robotic manipulator, is used to grasp the smaller active microgrippers. An interlocking mechanism is introduced to the interface to lock the microgripper and prevent it from sliding. The inverted hinged structure operates as a bridge that connects the microgripper pads to the robotic manipulator probes enabling the transmission of current. This allows the active microgripper to act as both an actuator and as a feedback sensor. The interface highly improves the interchangeability properties of the microgrippers, where replacing damaged microgrippers is easily performed and the setup time and effort would be significantly reduced. This paper is a part of an ongoing work which involves the automation of the assembly of MEMS, used to construct out-of-plane 3D microstructures
  • Keywords
    actuators; electric current; grippers; microassembling; micromanipulators; probes; sensors; 3-pad active microgripper interface; 3D microstructures; actuator; electric current; feedback sensor; interlocking mechanism; micro electromechanical systems; microassembly; robotic manipulator; three-dimensional MEMS; tungsten probes; Assembly systems; Bonding; Grippers; Manipulators; Microassembly; Micromechanical devices; Microstructure; Probes; Robotic assembly; Robots; Active microgripper interface; automation; hinged microstructure; microassembly;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical and Computer Engineering, 2006. CCECE '06. Canadian Conference on
  • Conference_Location
    Ottawa, Ont.
  • Print_ISBN
    1-4244-0038-4
  • Electronic_ISBN
    1-4244-0038-4
  • Type

    conf

  • DOI
    10.1109/CCECE.2006.277563
  • Filename
    4054917