Title :
High Speed Ethernet Interface between TE and MT in 3GPP LTE Network
Author :
Baek, Yong-Soo ; Min, Sung-Gi ; Lee, Hyun-Gu
Author_Institution :
Dept. of Comput. & Radio Commun. Eng., Korea Univ., Seoul, South Korea
Abstract :
Data rates in 3 GPP LTE supports 100 Mbps in the downlink and 50 Mbps in the uplink. Currently, almost all manufactured MTs uses HDLC_PPP to make connections between TE and MT. However HDLC_PPP uses byte stuffing for HDLC framing. As the communication speed is increased dramatically between TE and MT, byte stuffing seriously limits communication speed. As the connection methods between TE and MT and between MT and RN Care different, HDLC_PPP used between TE and MT can be replaced by other method without affecting the wireless interface. We propose an Ethernet interface instead of HDLC_PPP interface. The Ethernet-based interface provides higher data throughput than that of HDLC_PPP. The test result shows that data throughputs of HDLC_PPP over USB, pure Ethernet, and Ethernet over USB are 18 Mbps,95 Mbps, and 68 Mbps respectively.
Keywords :
3G mobile communication; local area networks; protocols; telecommunication terminals; 3GPP LTE network; HDLC framing; HDLC_PPP interface; MT; TE; USB; bit rate 100 Mbit/s; bit rate 18 Mbit/s; bit rate 50 Mbit/s; bit rate 68 Mbit/s; bit rate 95 Mbit/s; byte stuffing; communication speed; high-speed Ethernet interface; mobile terminal; point-to-point protocol over high-level data link control; terminal equipment; wireless interface; Access protocols; Authentication; Communication system control; Downlink; Ethernet networks; GSM; Tellurium; Testing; Throughput; Universal Serial Bus;
Conference_Titel :
Advances in Mesh Networks, 2009. MESH 2009. Second International Conference on
Conference_Location :
Athens, Glyfada
Print_ISBN :
978-0-7695-3667-5
Electronic_ISBN :
978-0-7695-3667-5
DOI :
10.1109/MESH.2009.11