Title :
Fluidic interconnects for modular assembly of chemical microsystems
Author :
González, C. ; Collins, S.D. ; Smith, R.L.
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., Davis, CA, USA
Abstract :
A new, hybrid technology is presented which enables the modular interconnection, assembly and packaging of individual microfabricated components and/or modules (e.g. pumps, valves, reaction chambers, control circuitry, etc.). This technology can be used to make compression seal fittings utilizing self-aligning, interlocking, mechanical bonding structures and photo-patternable silicone O-ring seals. Fluidic interconnects for microfluidic systems are demonstrated. An important feature of these interconnects are that they are completely reversible, i.e. interconnections can be repeatedly made with the same structures allowing flexible system assembly
Keywords :
assembling; chemical analysis; etching; flow control; fluidic devices; membranes; micropumps; modules; seals (stoppers); semiconductor device packaging; valves; MEMS components; chemical microsystems; compression seal fittings; control circuitry; flexible system assembly; fluidic interconnects; hybrid technology; individual microfabricated components; interlocking fins concept; mechanical bonding structures; microfluidic systems; modular assembly; modular interconnection; packaging; photo-patternable silicone O-ring seals; pumps; reaction chambers; self-aligning interlocking structures; valves; Assembly; Bonding; Chemical technology; Fitting; Integrated circuit interconnections; Microfluidics; Packaging; Pumps; Seals; Valves;
Conference_Titel :
Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-3829-4
DOI :
10.1109/SENSOR.1997.613703
