DocumentCode :
314187
Title :
Mechanical behavior of structures for microelectromechanical systems
Author :
Suwito, Wan ; Dunn, Martin L. ; Cunningham, Shawn J.
Author_Institution :
Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA
Volume :
1
fYear :
1997
fDate :
16-19 Jun 1997
Firstpage :
611
Abstract :
Our recent efforts to characterize the mechanical behavior of micromachined single crystal silicon structures are presented. These include the design and fabrication of free-standing thin film test structures, micromechanical tensile testing, and a proposed approach to correlate fracture initiation. The latter results in an apparent strength scaling of micromachined silicon structures that has obvious ramifications with regard to the design of reliable MEMS structures without exhaustive testing
Keywords :
elemental semiconductors; fracture; micromachining; micromechanical devices; semiconductor epitaxial layers; silicon; tensile testing; Si; design; fabrication; fracture initiation; free-standing thin film test structures; mechanical behavior; microelectromechanical systems; micromachined silicon structures; micromachined single crystal silicon structures; micromechanical tensile testing; reliable MEMS structures; strength scaling; Etching; Fabrication; Mechanical factors; Microelectromechanical systems; Micromechanical devices; Resists; Silicon; Tensile stress; Testing; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-3829-4
Type :
conf
DOI :
10.1109/SENSOR.1997.613725
Filename :
613725
Link To Document :
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