• DocumentCode
    3143467
  • Title

    Robust design and innovation diffusion a contextual analysis

  • Author

    Chen, Hui-Fen ; Chu, Tsai-Hsin

  • Author_Institution
    Grad. Inst. of Technol. & Innovation Manage., Nat. Cheng-Chi Univ., Taipei
  • fYear
    2008
  • fDate
    21-24 Sept. 2008
  • Firstpage
    41
  • Lastpage
    46
  • Abstract
    This study aims to explore a successful learning innovation diffusion in Taiwanese society. Applying the lens of robust design, our specific research question is: How would robust design blend in with institutional conditions and make the innovation diffuse successfully? Our investigation is anchored on a case study on the diffusion of an e-learning system on primary and middle school students in Taiwan. Our findings suggest that successful diffusion occurs when the design features of innovation can blend in with institutional conditions. By reviewing userspsila learning behavior induced by an e-learning innovation, we identify how the design features cope with the cultural and educational conditions which have raised challenges for both Taiwanese students and their parents. Our study advances the concept of robust design by noting the importance of an institution on innovation diffusion. Theoretical contributions and practical suggestions are also elaborated.
  • Keywords
    computer aided instruction; design engineering; innovation management; Taiwanese society; e-learning innovation; e-learning system; innovation diffusion; robust design; Cultural differences; Data analysis; Educational institutions; Electronic learning; Innovation management; Lenses; Optical design; Product design; Robustness; Technological innovation; Innovation diffusion; e-learning; institution; robust design;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Management of Innovation and Technology, 2008. ICMIT 2008. 4th IEEE International Conference on
  • Conference_Location
    Bangkok
  • Print_ISBN
    978-1-4244-2329-3
  • Electronic_ISBN
    978-1-4244-2330-9
  • Type

    conf

  • DOI
    10.1109/ICMIT.2008.4654334
  • Filename
    4654334