DocumentCode :
3143639
Title :
fWLR supported process development based on V- and J-ramp stress tests
Author :
Aal, A.
Author_Institution :
ELMOS Semicond. AG, Dortmund, Germany
fYear :
2009
fDate :
18-22 Oct. 2009
Firstpage :
141
Lastpage :
144
Abstract :
In this work ramp stress procedures were utilized to support both process development as well as continued improvement in the reliability of tunnel oxides used in EEPROM devices of automotive applications. In order to enhance the reliability assessment opportunities trapped oxide charge (¿qot) breakdown distributions were constructed by combining the measured charge-to-breakdown (qbd) distributions with representative difference IV-curves recorded during breakdown measurements. While the qbd-data regularly used for interface quality assessment strongly depends on the type of ramp test, e.g. linearly RVS(T) (ramped voltage stress (test)), ERCS (exponentially ramped current stress), linear RCS (ramped current stress) and also its ramp speed, the tapped charge at breakdown is less dependent on measurement type and also very sensitive to interface properties.
Keywords :
EPROM; circuit reliability; stress analysis; testing; EEPROM devices; J-ramp stress tests; V-ramp stress tests; automotive applications; breakdown measurements; exponentially ramped current stress; interface quality assessment; linear ramped current stress; linearly ramped voltage stress; trapped oxide charge breakdown distributions; tunnel oxide reliability; Automotive applications; Breakdown voltage; Charge measurement; Current measurement; EPROM; Electric breakdown; Q measurement; Quality assessment; Stress; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 2009. IRW '09. IEEE International
Conference_Location :
S. Lake Tahoe, CA
ISSN :
1930-8841
Print_ISBN :
978-1-4244-3921-8
Electronic_ISBN :
1930-8841
Type :
conf
DOI :
10.1109/IRWS.2009.5383012
Filename :
5383012
Link To Document :
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