Title :
Effects of various applications on relative lifetime of processor cores
Author :
Gupta, T. ; Bertolini, C. ; Heron, O. ; Ventroux, N. ; Zimmer, T. ; Marc, F.
Author_Institution :
LIST, CEA, Gif-sur-Yvette, France
Abstract :
The lifetime of integrated chip tends to decrease more and more with technology scaling. To check if a design is robust, in this paper we present RTME (real time MTTF evaluation), a simulation framework that enables the evaluation of reliability at higher level of abstraction layer. Using the output of RTME, we are able to distinguish the effect of different benchmarks on different blocks of the processor.
Keywords :
microprocessor chips; RTME; integrated chip lifetime; processor block; processor cores; real time MTTF evaluation; reliability evaluation; technology scaling; Aging; Circuit simulation; Degradation; Electromigration; Electrons; Failure analysis; Hot carrier injection; Human computer interaction; Niobium compounds; Titanium compounds; Digital circuits; Power Consumption; Processor; Reliability; Simulation; Temperature;
Conference_Titel :
Integrated Reliability Workshop Final Report, 2009. IRW '09. IEEE International
Conference_Location :
S. Lake Tahoe, CA
Print_ISBN :
978-1-4244-3921-8
Electronic_ISBN :
1930-8841
DOI :
10.1109/IRWS.2009.5383013