Title :
The Planar Package Planner for System Designers
Author :
Heller, William R. ; Maling, Klim ; Sorkin, G.
Author_Institution :
International Business Machines Corporation, Poughkeepsie, NY
Abstract :
The Planar Package Planner is a design aid aimed at helping to form a package layout plan, given only the information available during project initiation to digital system logic and package designers. A hierarchical approach is adopted, and a clustering program makes possible use of the layout scheme for bottom-up as well as top-down design. The layout plan for an experimental microprocessor is worked out as an example of the method.
Keywords :
Assembly; Books; Chip scale packaging; Clustering algorithms; Digital systems; Europe; Logic design; Packaging machines; Process design; Shape;
Conference_Titel :
Design Automation, 1982. 19th Conference on
Conference_Location :
Las Vegas, NV, USA
Print_ISBN :
0-89791-020-6
DOI :
10.1109/DAC.1982.1585509