DocumentCode :
3143733
Title :
The Planar Package Planner for System Designers
Author :
Heller, William R. ; Maling, Klim ; Sorkin, G.
Author_Institution :
International Business Machines Corporation, Poughkeepsie, NY
fYear :
1982
fDate :
14-16 June 1982
Firstpage :
253
Lastpage :
260
Abstract :
The Planar Package Planner is a design aid aimed at helping to form a package layout plan, given only the information available during project initiation to digital system logic and package designers. A hierarchical approach is adopted, and a clustering program makes possible use of the layout scheme for bottom-up as well as top-down design. The layout plan for an experimental microprocessor is worked out as an example of the method.
Keywords :
Assembly; Books; Chip scale packaging; Clustering algorithms; Digital systems; Europe; Logic design; Packaging machines; Process design; Shape;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation, 1982. 19th Conference on
Conference_Location :
Las Vegas, NV, USA
ISSN :
0146-7123
Print_ISBN :
0-89791-020-6
Type :
conf
DOI :
10.1109/DAC.1982.1585509
Filename :
1585509
Link To Document :
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