Title :
A fast, simple wafer-level Hall-mobility measurement technique
Author :
Yu, L.C. ; Cheung, K.P. ; Tilak, V. ; Dunne, G. ; Matocha, K. ; Campbell, J.P. ; Suehle, J.S. ; Sheng, K.
Author_Institution :
Semicond. Electron. Div., NIST, Gaithersburg, MD, USA
Abstract :
Mobility is a good indicator of device reliability. High channel mobility is one of the biggest challenges especially in novel devices such as high-k based MOSFET, III-V devices and SiC power MOSFET etc. Accurate measurement of channel mobility is required for studying the limiting mechanism of mobility. Hall mobility is more favorable than effective mobility or field effect mobility because it takes into account only the mobile charges, which is essential for measuring novel devices that have a very high trap density. However, regular Hall measurement involves a bulky system and tedious sample preparation, which inhibit frequent use. In this paper, we demonstrate a fast and easy to implement wafer-level Hall-mobility measurement technique that allows for large survey of many devices under various conditions.
Keywords :
Hall mobility; MOSFET; wafer bonding; Hall mobility; SiC; device reliability; field effect mobility; high channel mobility; power MOSFET; trap density; wafer-level hall-mobility measurement technique; Current measurement; Density measurement; Hall effect; High K dielectric materials; High-K gate dielectrics; III-V semiconductor materials; MOSFET circuits; Measurement techniques; Power MOSFET; Silicon carbide;
Conference_Titel :
Integrated Reliability Workshop Final Report, 2009. IRW '09. IEEE International
Conference_Location :
S. Lake Tahoe, CA
Print_ISBN :
978-1-4244-3921-8
Electronic_ISBN :
1930-8841
DOI :
10.1109/IRWS.2009.5383030