DocumentCode :
3144136
Title :
Interfacial engineering of InGaAs/high-k metal-oxide-semiconductor field effect transistors (MOSFETs)
Author :
Sonnet, A.M. ; Galatage, R.V. ; Jivani, M.N. ; Milojevic, M. ; Chapman, R.A. ; Hinkle, C.L. ; Wallace, R.M. ; Vogel, E.M.
Author_Institution :
Dept. of Electr. Eng. & Mater. Sci. & Eng., Univ. of Texas at Dallas, Richardson, TX, USA
fYear :
2009
fDate :
18-22 Oct. 2009
Firstpage :
46
Lastpage :
49
Abstract :
The electrical properties of InxGa1-xAs (x=0.53, x=0.65) MOSFETs have been studied for three different ex-situ surface passivation techniques (HF clean, (NH4)2S clean and PECVD a-Si interlayer) with HfO2 gate dielectric (4 nm and 8 nm) and Ni/Au gate metal. In0.65Ga0.35As devices demonstrate much higher drive current than In0.53Ga0.47As devices. Devices with an a-Si IPL exhibit the highest drive current and mobility, whereas (NH4)2S surface cleaned devices show higher drive current, trans-conductance and mobility compared to HF cleaned devices. Also devices with a-Si IPL and (NH4)2S clean shows the highest and the lowest sub-threshold swing, respectively. Furthermore charge pumping measurements show a similar average mid-gap Dit indicating that mid-gap Dit is not related to the improvement in transport characteristics.
Keywords :
III-V semiconductors; MOSFET; amorphous semiconductors; dielectric materials; electron mobility; elemental semiconductors; gallium arsenide; hafnium compounds; high-k dielectric thin films; indium compounds; interface states; passivation; silicon; surface cleaning; (NH4)2S clean; HF clean; In0.53Ga0.47As-Si-HfO2-Ni-Au; In0.65Ga0.35As-Si-HfO2-Ni-Au; MOSFET; PECVD a-Si interlayer; a-Si IPL; charge pumping; drive current; electrical properties; electron mobility; ex-situ surface passivation; gate dielectric; gate metal; high-k metal-oxide-semiconductor field effect transistor; interfacial engineering; midgap interface trap density; size 4 nm; size 8 nm; subthreshold swing; surface cleaning; transconductance; transport property; Charge pumps; FETs; Gold; Hafnium oxide; High K dielectric materials; High-K gate dielectrics; Indium gallium arsenide; MOSFETs; Passivation; Surface cleaning;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 2009. IRW '09. IEEE International
Conference_Location :
S. Lake Tahoe, CA
ISSN :
1930-8841
Print_ISBN :
978-1-4244-3921-8
Electronic_ISBN :
1930-8841
Type :
conf
DOI :
10.1109/IRWS.2009.5383036
Filename :
5383036
Link To Document :
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