DocumentCode
3144192
Title
A new degradation scheme for direct-tunneling ultrathin gate dielectric
Author
Kimizuka, N. ; Yamamoto, T. ; Mogami, T.
Author_Institution
Silicon Syst. Res. Labs., NEC Corp., Kanagawa, Japan
fYear
1998
fDate
9-11 June 1998
Firstpage
162
Lastpage
163
Abstract
A new degradation scheme for ultrathin gate dielectric is presented on the basis of gate current. By using Drain Avalanche Hot Carrier (DAHC) injection, we demonstrate for the first time that the hot-carrier induced trapping enhances the direct-tunneling gate leakage current of MOSFETs. We also show that oxynitrided dielectric exhibits a higher resistance against hot-carrier injection. Moreover, an anomalous increase was found without affecting Gm degradation trends under hot-carrier stressing. Therefore, gate current is a very important parameter in the reliability of ultrathin gate dielectric.
Keywords
MOS integrated circuits; MOSFET; dielectric thin films; electron traps; hot carriers; integrated circuit reliability; leakage currents; semiconductor device reliability; tunnelling; MOSFETs; degradation scheme; direct-tunneling gate dielectric; direct-tunneling gate leakage current; drain avalanche hot carrier injection; gate current; hot-carrier induced trapping; oxynitrided dielectric; ultrathin gate dielectric; Degradation; Dielectrics; FETs; Hot carrier injection; Hot carriers; Leakage current; MOSFET circuits; Stress; Transconductance; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, 1998. Digest of Technical Papers. 1998 Symposium on
Conference_Location
Honolulu, HI, USA
Print_ISBN
0-7803-4770-6
Type
conf
DOI
10.1109/VLSIT.1998.689241
Filename
689241
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