• DocumentCode
    3144192
  • Title

    A new degradation scheme for direct-tunneling ultrathin gate dielectric

  • Author

    Kimizuka, N. ; Yamamoto, T. ; Mogami, T.

  • Author_Institution
    Silicon Syst. Res. Labs., NEC Corp., Kanagawa, Japan
  • fYear
    1998
  • fDate
    9-11 June 1998
  • Firstpage
    162
  • Lastpage
    163
  • Abstract
    A new degradation scheme for ultrathin gate dielectric is presented on the basis of gate current. By using Drain Avalanche Hot Carrier (DAHC) injection, we demonstrate for the first time that the hot-carrier induced trapping enhances the direct-tunneling gate leakage current of MOSFETs. We also show that oxynitrided dielectric exhibits a higher resistance against hot-carrier injection. Moreover, an anomalous increase was found without affecting Gm degradation trends under hot-carrier stressing. Therefore, gate current is a very important parameter in the reliability of ultrathin gate dielectric.
  • Keywords
    MOS integrated circuits; MOSFET; dielectric thin films; electron traps; hot carriers; integrated circuit reliability; leakage currents; semiconductor device reliability; tunnelling; MOSFETs; degradation scheme; direct-tunneling gate dielectric; direct-tunneling gate leakage current; drain avalanche hot carrier injection; gate current; hot-carrier induced trapping; oxynitrided dielectric; ultrathin gate dielectric; Degradation; Dielectrics; FETs; Hot carrier injection; Hot carriers; Leakage current; MOSFET circuits; Stress; Transconductance; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, 1998. Digest of Technical Papers. 1998 Symposium on
  • Conference_Location
    Honolulu, HI, USA
  • Print_ISBN
    0-7803-4770-6
  • Type

    conf

  • DOI
    10.1109/VLSIT.1998.689241
  • Filename
    689241