DocumentCode :
3144192
Title :
A new degradation scheme for direct-tunneling ultrathin gate dielectric
Author :
Kimizuka, N. ; Yamamoto, T. ; Mogami, T.
Author_Institution :
Silicon Syst. Res. Labs., NEC Corp., Kanagawa, Japan
fYear :
1998
fDate :
9-11 June 1998
Firstpage :
162
Lastpage :
163
Abstract :
A new degradation scheme for ultrathin gate dielectric is presented on the basis of gate current. By using Drain Avalanche Hot Carrier (DAHC) injection, we demonstrate for the first time that the hot-carrier induced trapping enhances the direct-tunneling gate leakage current of MOSFETs. We also show that oxynitrided dielectric exhibits a higher resistance against hot-carrier injection. Moreover, an anomalous increase was found without affecting Gm degradation trends under hot-carrier stressing. Therefore, gate current is a very important parameter in the reliability of ultrathin gate dielectric.
Keywords :
MOS integrated circuits; MOSFET; dielectric thin films; electron traps; hot carriers; integrated circuit reliability; leakage currents; semiconductor device reliability; tunnelling; MOSFETs; degradation scheme; direct-tunneling gate dielectric; direct-tunneling gate leakage current; drain avalanche hot carrier injection; gate current; hot-carrier induced trapping; oxynitrided dielectric; ultrathin gate dielectric; Degradation; Dielectrics; FETs; Hot carrier injection; Hot carriers; Leakage current; MOSFET circuits; Stress; Transconductance; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, 1998. Digest of Technical Papers. 1998 Symposium on
Conference_Location :
Honolulu, HI, USA
Print_ISBN :
0-7803-4770-6
Type :
conf
DOI :
10.1109/VLSIT.1998.689241
Filename :
689241
Link To Document :
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