DocumentCode
3144236
Title
Vt instability in high bit-count-per-cell Floating-Gate Non-Volatile memories
Author
Yang, Jindong ; Tao, Guoqiao
Author_Institution
NXP Semicond., Nijmegen, Netherlands
fYear
2009
fDate
18-22 Oct. 2009
Firstpage
15
Lastpage
19
Abstract
Floating gate cell array reliability associated with high-bit-count per cell (multi-level cell with >=3 bit/cell) is investigated. A high operating voltage during P/E operation can cause excessive charge injection into the inter-poly-dielectrics layers (IPD), and subsequent charge displacement will cause data retention or read-disturb problems. The Vt shift due to this charge displacement is related to the cell Vt, the amount of trapped charges the nitride layer and the applied external voltage. For a reliable product operation, the high voltage should be limited to keep the charge in the nitride layer to an acceptable level.
Keywords
random-access storage; Vt instability; charge displacement; floating gate cell array reliability; high bit-count-per-cell floating-gate nonvolatile memories; interpoly-dielectrics layers; Capacitance; Capacitors; Character generation; Dielectrics; Displacement control; Electron traps; Nonvolatile memory; Semiconductor device reliability; Silicon; Threshold voltage; NVM; charge displacement; multi-level cell; retention;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 2009. IRW '09. IEEE International
Conference_Location
S. Lake Tahoe, CA
ISSN
1930-8841
Print_ISBN
978-1-4244-3921-8
Electronic_ISBN
1930-8841
Type
conf
DOI
10.1109/IRWS.2009.5383042
Filename
5383042
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