• DocumentCode
    3144236
  • Title

    Vt instability in high bit-count-per-cell Floating-Gate Non-Volatile memories

  • Author

    Yang, Jindong ; Tao, Guoqiao

  • Author_Institution
    NXP Semicond., Nijmegen, Netherlands
  • fYear
    2009
  • fDate
    18-22 Oct. 2009
  • Firstpage
    15
  • Lastpage
    19
  • Abstract
    Floating gate cell array reliability associated with high-bit-count per cell (multi-level cell with >=3 bit/cell) is investigated. A high operating voltage during P/E operation can cause excessive charge injection into the inter-poly-dielectrics layers (IPD), and subsequent charge displacement will cause data retention or read-disturb problems. The Vt shift due to this charge displacement is related to the cell Vt, the amount of trapped charges the nitride layer and the applied external voltage. For a reliable product operation, the high voltage should be limited to keep the charge in the nitride layer to an acceptable level.
  • Keywords
    random-access storage; Vt instability; charge displacement; floating gate cell array reliability; high bit-count-per-cell floating-gate nonvolatile memories; interpoly-dielectrics layers; Capacitance; Capacitors; Character generation; Dielectrics; Displacement control; Electron traps; Nonvolatile memory; Semiconductor device reliability; Silicon; Threshold voltage; NVM; charge displacement; multi-level cell; retention;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 2009. IRW '09. IEEE International
  • Conference_Location
    S. Lake Tahoe, CA
  • ISSN
    1930-8841
  • Print_ISBN
    978-1-4244-3921-8
  • Electronic_ISBN
    1930-8841
  • Type

    conf

  • DOI
    10.1109/IRWS.2009.5383042
  • Filename
    5383042