• DocumentCode
    3144431
  • Title

    A framework for managing risks on concurrent engineering basis

  • Author

    Ahn, J.O. ; Jeung, H.S. ; Kim, J.S. ; Choi, H.G.

  • Author_Institution
    Dept. of Syst. Manage. Eng., Sungkyunkwan Univ., Suwon
  • fYear
    2008
  • fDate
    21-24 Sept. 2008
  • Firstpage
    293
  • Lastpage
    298
  • Abstract
    Recently, risk management in product development processes has been regarded as an important issue in many manufacturers. Although many different approaches have been suggested to deal with various risks frequently occurred in business level such as cost related fields, there have been few studies for managing various risks in plant level. This paper suggests a new risk management framework (RMF) for managing risks in product development processes. The RMF presents risk factors along with their degrees and shows the proper activities to respond to those risks on the basis of operations, processes and departments under concurrent engineering environment. Also, this framework adapts a network model to determine the optimized paths for establish a successful product development process. In this paper, we focus on the structure or architecture defending systematically various risks.
  • Keywords
    concurrent engineering; industrial plants; manufacturing industries; product development; risk management; business level; concurrent engineering; plant level; product development process; product manufacturers; risk management framework; Concurrent engineering; Costs; Decision making; Engineering management; Investments; Manufacturing processes; Product development; Risk management; Systems engineering and theory; Virtual manufacturing; concurrent engineering; network models; responding activities; risk degrees; risk factors; risk management framework;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Management of Innovation and Technology, 2008. ICMIT 2008. 4th IEEE International Conference on
  • Conference_Location
    Bangkok
  • Print_ISBN
    978-1-4244-2329-3
  • Electronic_ISBN
    978-1-4244-2330-9
  • Type

    conf

  • DOI
    10.1109/ICMIT.2008.4654379
  • Filename
    4654379