Optimization of reflow-thermal profile by design of experiments with response surface methodology for minimizing solder-ball defects

Electronics-assembly companies are always trying to reduce solder-ball defects as their customers keep tightening specification since the solder balls could cause electrical short circuit and damage to the product. The effect of solder ball defects is not only on quality risk, but also on scrap costs. Consequently, electronics-assembly companies need to keep focusing on minimizing this type of defects. One initiative to overcome this problem is to minimize the spattering of solder while the product is passing through reflow-soldering oven. Reflow soldering is a complex process, which requires specific optimal soldering conditions based on experimental data. The trial-and-error method to determine the optimal conditions would require a prohibitively large number of experiments, however, and so the Response Surface Methodology (RSM) has been employed in this research to overcome this problem.