DocumentCode
3145300
Title
Analysis of time dependent dielectric breakdown in nanoscale CMOS circuits
Author
Lee, Ho Joon ; Kim, Kyung Ki
Author_Institution
Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
fYear
2011
fDate
17-18 Nov. 2011
Firstpage
440
Lastpage
443
Abstract
As CMOS technology is scaled down more aggressively; the reliability mechanism (or aging effect) caused by progressive gate oxide breakdown, also called time dependent dielectric breakdown (TDDB), has become a major reliability concern. With the present of TDDB, it is difficult to control the ON current of the MOSFET device. In addition, nanoscale CMOS circuits suffer from increased gate leakage current and power consumption. In this paper, the TDDB effects on delay and power of the nanoscale CMOS circuits are analyzed using inverter chains and ISCAS85 benchmark circuits, which are designed using 45-nm CMOS predictive technology model. Finally, we discuss post-silicon adaptive tuning techniques to compensate the TDDB impact on the CMOS circuits.
Keywords
CMOS integrated circuits; delays; electric breakdown; integrated circuit reliability; invertors; leakage currents; CMOS predictive technology model; ISCAS85 benchmark circuit; MOSFET device; ON current; TDDB; gate leakage current; inverter chain; nanoscale CMOS circuit; post-silicon adaptive tuning technique; power consumption; progressive gate oxide breakdown; size 45 nm; time dependent dielectric breakdown; TDDB; aging effect; reliability; time dependent dielectric breakdown;
fLanguage
English
Publisher
ieee
Conference_Titel
SoC Design Conference (ISOCC), 2011 International
Conference_Location
Jeju
Print_ISBN
978-1-4577-0709-4
Electronic_ISBN
978-1-4577-0710-0
Type
conf
DOI
10.1109/ISOCC.2011.6138626
Filename
6138626
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