Structural characterization of the silver-polyaniline nanocomposite for electronic devices

Author

Imran, S.M. ; Moiz, S.A. ; Ahmed, M.M. ; Lee, Jung Hoo ; Kim, Hee-Taik

Author_Institution

Dept. of Chem. Eng., Hanyang Univ., Ansan, South Korea

fYear

2009

fDate

14-15 Dec. 2009

Firstpage

1

Lastpage

4

Abstract

Incorporation of metal nanoparticles in Polyaniline composites could effectively improve its optical, thermal and electrical properties and making it an ideal for the use in semiconductor industry. In this study Ag nanoparticles were uniformly dispersed ultrasonically in the solution of polyaniline emeraldine base (PANIEB) and isopropyl alcohol. PANIEB used in this experiment were doped with polymer of methacrylic acid ester and vinyl verstate. The results about the morphological, optical and electrical properties of Ag-PANIEB with IPA colloid as a function of different concentration of Ag nanoparticles (Such as 25%, 50%, 100% by weight) were presented and discussed.

Keywords

colloids; conducting polymers; filled polymers; nanocomposites; silver; colloid; electronic devices; isopropyl alcohol; metal nanoparticles; methacrylic acid ester; polyaniline emeraldine base; silver-polyaniline nanocomposite; vinyl verstate; Chemical engineering; Electronics industry; Industrial electronics; Nanoparticles; Nanoscale devices; Optical devices; Optical polymers; Silver; Thermal conductivity; Thermal engineering; Electrical Properties; Isopropyl Alcohol; Nanocomposites; Polyaniline; Silver;

fLanguage

English

Publisher

ieee

Conference_Titel

Multitopic Conference, 2009. INMIC 2009. IEEE 13th International

Conference_Location

Islamabad

Print_ISBN

978-1-4244-4872-2

Electronic_ISBN

978-1-4244-4873-9

Type

conf

DOI

10.1109/INMIC.2009.5383104

Filename

5383104