DocumentCode
3145957
Title
Integrated Passive Device based RF circuit design for low-cost System-in-Package transceivers
Author
Chang, Da-Chiang ; Hsu, Yuan-Chia ; Lin, Ta-Yeh ; Juang, Ying-Zong ; Haroun, Ibrahim
Author_Institution
Nat. Chip Implementation Center, Nat. Appl. Res. Labs., Hsinchu, Taiwan
fYear
2011
fDate
17-18 Nov. 2011
Firstpage
104
Lastpage
107
Abstract
This article presents and discusses the design of RF circuits using Integrated Passive Devices (IPDs) technology appropriate for the development of low-cost and high performance System-in-Package (SiP) wireless transceivers. Two examples, a 6-GHz voltage-controlled oscillator (VCO) and a 60-GHz 90° coupler are introduced to demonstrate the implementation of RF circuit design using an IPD process. Experimental results of the VCO and the 90° coupler will be presented and compared with the simulation results.
Keywords
CMOS integrated circuits; integrated circuit design; radio transceivers; system-in-package; voltage-controlled oscillators; IPD process; VCO; high performance system-in-package wireless transceiver; integrated passive device based RF circuit design; low-cost system-in-package transceiver; voltage-controlled oscillator; 90° Coupler; Co-design; IPD; RF CMOS; SiP; VCO;
fLanguage
English
Publisher
ieee
Conference_Titel
SoC Design Conference (ISOCC), 2011 International
Conference_Location
Jeju
Print_ISBN
978-1-4577-0709-4
Electronic_ISBN
978-1-4577-0710-0
Type
conf
DOI
10.1109/ISOCC.2011.6138657
Filename
6138657
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