Title :
Silicon Nanotweezers with Adjustable and Controllable Gap for the Manipulation and Characterization of DNA Molecules
Author :
Yamahata, C. ; Takekawa, T. ; Ayano, K. ; Hosogi, M. ; Kumemura, M. ; Legrand, B. ; Collard, D. ; Hashiguchi, G. ; Fujita, H.
Author_Institution :
Inst. of Ind. Sci., Tokyo Univ.
Abstract :
We describe electrostatically actuated silicon nanotweezers which are intended for the manipulation and characterization of DNA molecules. The fabrication process combines KOH etching and deep reactive ion etching (DRIE) on silicon-on-insulator (SOI) wafer to form sharp nanotips and high aspect ratio microstructures, respectively. The microelectromechanical system (MEMS) consists of a pair of opposing tips, the distance of which can be accurately adjusted thanks to a high resolution differential capacitive sensor. The device shows a resolution of 5 nm for a displacement range of 3 mum (static mode). It has a resonant frequency at 2 kHz and a quality factor of 40 in air, and 550 in vacuum
Keywords :
DNA; bioMEMS; biological techniques; capacitive sensors; electrostatic actuators; molecular biophysics; nanotechnology; radiation pressure; silicon; silicon-on-insulator; sputter etching; 2 kHz; DNA molecule characterization; DNA molecule manipulation; KOH; KOH etching; MEMS; SOI; Si; Si-SiO2; air media; deep reactive ion etching; dielectrophoresis; differential capacitive sensor; electrostatic actuated silicon nanotweezers; fabrication process; high aspect ratio microstructures; microelectromechanical system; quality factor; sharp nanotips; silicon-on-insulator wafer; vacuum media; Capacitive sensors; DNA; Etching; Fabrication; Microelectromechanical systems; Micromechanical devices; Microstructure; Q factor; Resonant frequency; Silicon on insulator technology; Dielectrophoresis; Differential Capacitive Sensor; Silicon-On-Insulator; lambda-DNA;
Conference_Titel :
Microtechnologies in Medicine and Biology, 2006 International Conference on
Conference_Location :
Okinawa
Print_ISBN :
1-4244-0338-3
Electronic_ISBN :
1-4244-0338-3
DOI :
10.1109/MMB.2006.251507
