Title :
Ultra compact RFICs using three-dimensional MMIC technology
Author :
Kaho, T. ; Yamaguchi, Yoshio ; Nishikawa, Kiisa ; Toyoda, Ichihiko ; Uehara, Kazuhiro
Author_Institution :
NTT Corporation, Yokosuka, Japan
Abstract :
Since the 1980s, NTT has been developing three- dimensional (3D) monolith microwave integrated circuits (MMICs) to achieve small-size and low-cost ICs. The usage of 3D MMICs is a very powerful technique, especially at quasi-millimeter and millimeter wave. We describe the structure and features of 3D MMICs, introduce several MMIC subsystems, and point out future directions and plans for using 3D MMICs.
Keywords :
Integrated circuit technology; MMICs; Microwave integrated circuits; Microwave technology; Millimeter wave integrated circuits; Millimeter wave technology; Monolithic integrated circuits; Packaging; Radiofrequency integrated circuits;
Conference_Titel :
Microwave Symposium Digest (MTT), 2010 IEEE MTT-S International
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-4244-6056-4
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2010.5517752
