Title :
Are electromigration failures lognormally distributed?
Author :
Towner, Janet M.
Author_Institution :
Xicor Inc., Milpitas, CA, USA
Abstract :
Electromigration lifetests performed on a variety of Al alloy films to study the form of the failure distribution are discussed. Sample sizes ranged from 35 to 120, allowing exploration near the 1% failure level. Results show that the lognormal rather than the logarithmic extreme value distribution holds where the grain size is smaller than the linewidth. Where the grain exceeds the linewidth, however, either distribution can be used to represent the data.<>
Keywords :
aluminium alloys; copper alloys; electromigration; failure analysis; grain size; life testing; metallic thin films; metallisation; silicon alloys; Al alloy films; AlCu; AlSi; electromigration failures; failure distribution; grain size; linewidth; logarithmic extreme value distribution; lognormal distribution; Ceramics; Circuit testing; Conductors; Electromigration; Grain size; Life estimation; Life testing; Optical films; Ovens; Uncertainty;
Conference_Titel :
Reliability Physics Symposium, 1990. 28th Annual Proceedings., International
Conference_Location :
New Orleans, LA, USA
DOI :
10.1109/RELPHY.1990.66070
