DocumentCode
3146575
Title
Are electromigration failures lognormally distributed?
Author
Towner, Janet M.
Author_Institution
Xicor Inc., Milpitas, CA, USA
fYear
1990
fDate
27-29 March 1990
Firstpage
100
Lastpage
105
Abstract
Electromigration lifetests performed on a variety of Al alloy films to study the form of the failure distribution are discussed. Sample sizes ranged from 35 to 120, allowing exploration near the 1% failure level. Results show that the lognormal rather than the logarithmic extreme value distribution holds where the grain size is smaller than the linewidth. Where the grain exceeds the linewidth, however, either distribution can be used to represent the data.<>
Keywords
aluminium alloys; copper alloys; electromigration; failure analysis; grain size; life testing; metallic thin films; metallisation; silicon alloys; Al alloy films; AlCu; AlSi; electromigration failures; failure distribution; grain size; linewidth; logarithmic extreme value distribution; lognormal distribution; Ceramics; Circuit testing; Conductors; Electromigration; Grain size; Life estimation; Life testing; Optical films; Ovens; Uncertainty;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1990. 28th Annual Proceedings., International
Conference_Location
New Orleans, LA, USA
Type
conf
DOI
10.1109/RELPHY.1990.66070
Filename
66070
Link To Document