DocumentCode :
3147049
Title :
Characterizing the effects of transient faults on a high-performance processor pipeline
Author :
Wang, Nicholas J. ; Quek, Justin ; Rafacz, Todd M. ; Patel, Sanjay J.
Author_Institution :
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana-Champaign, IL, USA
fYear :
2004
fDate :
28 June-1 July 2004
Firstpage :
61
Lastpage :
70
Abstract :
The progression of implementation technologies into the sub-100 nanometer lithographies renew the importance of understanding and protecting against single-event upsets in digital systems. In this work, the effects of transient faults on high performance microprocessors is explored. To perform a thorough exploration, a highly detailed register transfer level model of a deeply pipelined, out-of-order microprocessor was created. Using fault injection, we determined that fewer than 15% of single bit corruptions in processor state result in software visible errors. These failures were analyzed to identify the most vulnerable portions of the processor, which were then protected using simple low-overhead techniques. This resulted in a 75% reduction in failures. Building upon the failure modes seen in the microarchitecture, fault injections into software were performed to investigate the level of masking that the software layer provides. Together, the baseline microarchitectural substrate and software mask more than 9 out of 10 transient faults from affecting correct program execution.
Keywords :
fault simulation; fault tolerant computing; logic testing; microprocessor chips; digital systems; fault injection; high performance microprocessors; microarchitectures; nanometer lithographies; processor pipeline; register transfer level model; transient faults; Digital systems; Failure analysis; Lithography; Microarchitecture; Microprocessors; Out of order; Pipelines; Protection; Registers; Software performance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Dependable Systems and Networks, 2004 International Conference on
Print_ISBN :
0-7695-2052-9
Type :
conf
DOI :
10.1109/DSN.2004.1311877
Filename :
1311877
Link To Document :
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