DocumentCode :
3147424
Title :
Preliminary study on organic memory embedded metal nanoparticle stacking layers
Author :
Yoshida, Yuji ; Chikamatsu, Masayuki
Author_Institution :
Photonics Res. Inst., Nat. Inst. of Adv. Ind. Sci. & Technol. (AIST), Tsukuba
fYear :
2008
fDate :
15-17 Sept. 2008
Abstract :
Summary form only given, as follows: Nonvolatile memory based on metal nanoparticles embedded in organic dielectric layers has been investigated as a candidate for organic memories. Here, we propose a novel memory composed of ordered metal nanoparticle layers between organic dielectric layers. The advantage of the memory is to control the storage of electric charges by changing the number of metal nanoparticle monolayers. The monolayer of metal nanoparticles formed at water surface by Langmuir trough and transferred onto the organic layers and/or substrates. The thickness of nanoparticle layers was controlled by the number of stacking. The memory device composed of ITO /organic layer / metal nano-particle layers / organic layer / Al. As a result, we observed the typical I-V hysteresis curve as a memory effect. The area of hysteresis curve increased with increasing the stacking numbers of nanoparticle layers. This indicates the stacking of metal nanoparticles controlled the amount of storage in organic memory device.
Keywords :
aluminium; dielectric devices; dielectric materials; hysteresis; indium compounds; monolayers; nanoparticles; organic compounds; random-access storage; I-V hysteresis curve; ITO-Al; ITO-organic layer-metal nanoparticle layer-organic layer-Al; electric charges; metal nanoparticle stacking layers; monolayer; nonvolatile memory; organic dielectric layers; organic memory device; water surface; Dielectric substrates; Hysteresis; Indium tin oxide; Metals industry; Nanoparticles; Nanoscale devices; Nonvolatile memory; Photonics; Stacking; Thickness control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrets, 2008. ISE-13. 13th International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4244-1850-3
Electronic_ISBN :
978-1-4244-1851-0
Type :
conf
DOI :
10.1109/ISE.2008.4814051
Filename :
4814051
Link To Document :
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