• DocumentCode
    3147566
  • Title

    Minimizing MOSFET power losses in near-field electromagnetic energy-harnessing ICs

  • Author

    Lazaro, Orlando ; Rincon-Mora, Gabriel Alfonso

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2011
  • fDate
    17-18 Nov. 2011
  • Firstpage
    377
  • Lastpage
    380
  • Abstract
    The value of distributed sensors, embedded biomedical implants, and other wireless microsystems is the information they collect, process, and transmit over time. Unfortunately, powering such tiny devices for extended periods is a major challenge because miniaturized batteries cannot store sufficient energy and connecting wires to recharge the batteries demands considerable space overhead. Electromagnetically coupling energy to recharge these devices wirelessly is possible, but practical only if power losses are low enough for sufficient energy to reach the batteries. Because small inductors capture little energy, minimizing the power that switches dissipate to energize and de-energize an inductor is critical. This paper presents how transmitted power changes with distance and, as a result, with inductive coupling factor kC, and shows how to use that information to minimize the power lost in the interconnecting MOSFETs. This way, a 0.18-μm near-field electromagnetic energy-harnessing IC loses on average (in simulations) 3 μW across kC´s ranging from 0.01 to 0.1, which roughly represents 3.9% of the total power transferred.
  • Keywords
    cells (electric); distributed sensors; embedded systems; inductive power transmission; interconnections; losses; micromechanical devices; power MOSFET; power inductors; Gabriel distributed sensor; MOSFET power loss minimization; coupling factor; electromagnetically coupling energy; embedded biomedical; inductor de-energization; interconnecting MOSFET; miniaturized battery; near-field electromagnetic energy-harnessing IC; power change transmission; wireless microsystem; Contactless Charging; Inductive (Electromagnetic) Coupling; Inductive Power Transfer; Wireless Power Transfer;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SoC Design Conference (ISOCC), 2011 International
  • Conference_Location
    Jeju
  • Print_ISBN
    978-1-4577-0709-4
  • Electronic_ISBN
    978-1-4577-0710-0
  • Type

    conf

  • DOI
    10.1109/ISOCC.2011.6138789
  • Filename
    6138789