DocumentCode
3147566
Title
Minimizing MOSFET power losses in near-field electromagnetic energy-harnessing ICs
Author
Lazaro, Orlando ; Rincon-Mora, Gabriel Alfonso
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2011
fDate
17-18 Nov. 2011
Firstpage
377
Lastpage
380
Abstract
The value of distributed sensors, embedded biomedical implants, and other wireless microsystems is the information they collect, process, and transmit over time. Unfortunately, powering such tiny devices for extended periods is a major challenge because miniaturized batteries cannot store sufficient energy and connecting wires to recharge the batteries demands considerable space overhead. Electromagnetically coupling energy to recharge these devices wirelessly is possible, but practical only if power losses are low enough for sufficient energy to reach the batteries. Because small inductors capture little energy, minimizing the power that switches dissipate to energize and de-energize an inductor is critical. This paper presents how transmitted power changes with distance and, as a result, with inductive coupling factor kC, and shows how to use that information to minimize the power lost in the interconnecting MOSFETs. This way, a 0.18-μm near-field electromagnetic energy-harnessing IC loses on average (in simulations) 3 μW across kC´s ranging from 0.01 to 0.1, which roughly represents 3.9% of the total power transferred.
Keywords
cells (electric); distributed sensors; embedded systems; inductive power transmission; interconnections; losses; micromechanical devices; power MOSFET; power inductors; Gabriel distributed sensor; MOSFET power loss minimization; coupling factor; electromagnetically coupling energy; embedded biomedical; inductor de-energization; interconnecting MOSFET; miniaturized battery; near-field electromagnetic energy-harnessing IC; power change transmission; wireless microsystem; Contactless Charging; Inductive (Electromagnetic) Coupling; Inductive Power Transfer; Wireless Power Transfer;
fLanguage
English
Publisher
ieee
Conference_Titel
SoC Design Conference (ISOCC), 2011 International
Conference_Location
Jeju
Print_ISBN
978-1-4577-0709-4
Electronic_ISBN
978-1-4577-0710-0
Type
conf
DOI
10.1109/ISOCC.2011.6138789
Filename
6138789
Link To Document