On the development of CMOS mmW and sub-THz phased array technology for communication/sensing nodes

In this paper, we present a single chip cross-layer approach for a new class of highly integrated CMOS millimeter wave and sub-THz communication and sensing wireless systems. It is based on the convergence of fully integrated CMOS digital radio and beam former, low power multi-gigabit mixed-signal processing and low cost packaging with embedded antenna. A 60GHz CMOS/PCB portable beam-former solution and highly scalable V-band CMOS 45nm architecture are highlighted as leading edge examples of such an approach, enabling breakthrough power/size reduction as well as multi-gigahertz bandwidth and processing speeds. These single chip millimeter wave and sub-THz system-on-chip solutions are the fundamental enablers for a wide range of communication and sensing applications operating from V-band to W-band and beyond.