Title :
K-band near-hermetic surface mount package using liquid crystal polymer for high power applications.
Author :
Chen, Ci ; Pham, A.
Author_Institution :
University of California, Davis, United States
Abstract :
We present the design and development of a K-band surface mount package for ∼10 Watt DC power dissipation devices. The package forms a near hermetic cavity enclosed by liquid crystal polymer (LCP) and copper. The measured junction temperature of ∼10 Watt DC power dissipation is 143.9oC with the base plate at 80oC. The package feedthrough achieves a measured insertion loss of ∼ 0.5 dB to 0.8 dB at K-band frequencies.
Keywords :
Copper; Frequency measurement; Insertion loss; K-band; Liquid crystal polymers; Loss measurement; Packaging; Power dissipation; Power measurement; Temperature measurement;
Conference_Titel :
Microwave Symposium Digest (MTT), 2010 IEEE MTT-S International
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-4244-6056-4
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2010.5517820
