• DocumentCode
    3148011
  • Title

    The origins of electromechanical response in polyurethane elastomers

  • Author

    Wang, H. ; Zhang, Q.M. ; Cross, L.E. ; Ting, R. ; Coughlin, C. ; Rittenmyer, K.

  • Author_Institution
    Mater. Res. Lab., Pennsylvania State Univ., University Park, PA, USA
  • fYear
    1991
  • fDate
    33457
  • Firstpage
    182
  • Lastpage
    185
  • Abstract
    Electric-field-induced strains of polyurethane elastomers have been measured. The mechanical constrains and flexure motion of the samples which can cause large experimental error were excluded from the measured strain signals. The longitudinal and transverse strain coefficients are evaluated as functions of frequency. The dielectric and elastic properties and their temperature and frequency dependencies have also been studied. The experimental results show that strain larger than 2% can be obtained and that the sample processing conditions can affect the strain level. The contributions from Maxwell stress effect and electrostriction to the strain responses are examined. The results suggest that Maxwell stress effect plays an important role in electromechanical response of the materials
  • Keywords
    Young´s modulus; dielectric losses; elastomers; electrostriction; permittivity; piezoelectric materials; strain measurement; Maxwell stress; Young´s modulus; dielectric properties; elastic properties; electric-field-induced strains; electromechanical response; electrostriction; flexure motion; frequency dependence; longitudinal strain coefficients; mechanical constrains; polyurethane elastomers; sample processing conditions; temperature dependence; transverse strain coefficients; Capacitive sensors; Dielectric measurements; Electric variables measurement; Electrostriction; Frequency; Mechanical variables measurement; Motion measurement; Strain measurement; Stress; Temperature dependence;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applications of Ferroelectrics, 1994.ISAF '94., Proceedings of the Ninth IEEE International Symposium on
  • Conference_Location
    University Park, PA
  • Print_ISBN
    0-7803-1847-1
  • Type

    conf

  • DOI
    10.1109/ISAF.1994.522333
  • Filename
    522333