Automatic Batch Processing in Multilayer Ceramic Metallization

This paper describes advances in the batch processing automation of multilayer ceramic metallization manufacturing. The metallization is a plating process that deposits electroless nickel and electroless gold on conductive molybdenum features. The plating operation involves the processing of up to 72 multilayer ceramic substrates in one group. Each product group automatically moves through 35 sequential chemical operations to complete the process. As a product is completed, the process parameters are monitored and stored by computers (IBM Series 1). In addition, the product transporters are controlled and monitored by computers. Other features of the system include: flexibility to incorporate process changes without affecting production, capability to increase capacity, common product handling, and automatic tracking for manufacturing.