Title :
Lumped-parameter thermal modeling of an IPEM using thermal component models
Author :
Ortiz-Rodriguez, Jose M. ; Hefner, Allen R. ; Berning, David ; Volez-Reyes, M. ; Hernindez-Mora, M. ; González, Jorge
Author_Institution :
UPRM-CPES, PR, USA
Abstract :
A thermal model for the CPES IPEM Gen. II is presented. The selected approach is the simulation of the thermal behavior of an experimental IPEM testbed using the ID finite difference method. An equivalent electrical network representation of the thermal behavior of the IPEM is developed using a ID finite approach. The SABER circuit simulation tool is used to verify the behavior of our network model and compare its results with previously acquired temperature measurements from the experimental testbed. Both experimental and simulated responses are presented and compared.
Keywords :
circuit simulation; equivalent circuits; finite difference methods; power electronics; temperature measurement; CPES IPEM testbed; ID finite approach; ID finite difference method; SABER circuit simulation tool; equivalent electrical network representation; lumped-parameter thermal modeling; temperature measurements; thermal component models; Circuit testing; Electronic packaging thermal management; Finite difference methods; Helium; Integrated circuit measurements; Power electronics; Power system modeling; Power system reliability; Silicon; Temperature;
Conference_Titel :
Computers in Power Electronics, 2004. Proceedings. 2004 IEEE Workshop on
Print_ISBN :
0-7803-8502-0
DOI :
10.1109/CIPE.2004.1428118
