• DocumentCode
    3148795
  • Title

    A kinematically intelligent blackboard for computer aided instruction

  • Author

    Nisbett, J. Keith ; Barker, Clark R. ; Watkins, Derek

  • Author_Institution
    Missouri Univ., Roola, MO, USA
  • fYear
    1993
  • fDate
    6-9 Nov 1993
  • Firstpage
    76
  • Lastpage
    80
  • Abstract
    A CAI (computer-aided instruction) package is being developed to be used as a classroom tool for the instruction of undergraduate mechanical engineering students in an introductory kinematics of mechanisms course. This graphical environment allows the instructor to emulate on the projected graphics screen everything that is currently done on the blackboard for planar mechansims. Unlike the blackboard, the software will have the intelligence to interpret the drawings in a kinematic sense so that the drawing of the linkage will behave as a linkage. The software environment involves three principal components: (1) a sketching method for defining the linkage, (2) the "kinematic intelligence" to interpret the sketch and animate the linkage, and (3) the ability to develop and demonstrate kinematic concepts
  • Keywords
    computer aided instruction; computer graphics; educational courses; intelligent tutoring systems; kinematics; mechanical engineering; mechanical engineering computing; CAI package; computer aided instruction; educational course; graphical environment; kinematic intelligence; kinematically intelligent blackboard; kinematics course; linkage; planar mechansims; projected graphics screen; sketching method; software environment; undergraduate mechanical engineering students; Analytical models; Computational modeling; Computer aided instruction; Computer simulation; Couplings; Education; Fluid dynamics; Kinematics; Packaging; Visualization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Frontiers in Education Conference, 1993. Twenty-Third Annual Conference. 'Engineering Education: Renewing America's Technology', Proceedings.
  • Conference_Location
    Washington, DC
  • ISSN
    0190-5848
  • Print_ISBN
    0-7803-1482-4
  • Type

    conf

  • DOI
    10.1109/FIE.1993.405564
  • Filename
    405564