DocumentCode :
3149542
Title :
Integration of electronic components into PCB for electromobility application
Author :
Hofmann, T. ; Gottschling, S. ; Wondrak, W. ; Randoll, R.
fYear :
2012
fDate :
15-18 Oct. 2012
Firstpage :
1
Lastpage :
4
Abstract :
In future the price of oil consumption will further increase. The emission of exhaust gases like CO2 will be restricted by politic regulations. This and also the desire of customers for green mobility drives OEM´s to bring electric or hybrid vehicles on the market where the development of electro mobility currently is enforced by the worldwide competition. Within the engine compartment of modern cars installation space is of major concern. Therefore small size and high integration level of the components are chances for automotive electronic control units. With novel integration of components into PCB technology new specific requirements are arising. Power electronics have to be placed close to the electric motor or - for hybrid electronic vehicles - close to the combustion engine. Here temperature stability and vibrational robust design become the major requirements. In this work new concepts for control units and power modules with innovative materials, packaging technologies and cooling concepts are presented.
Keywords :
automobiles; automotive electronics; electric drives; hybrid electric vehicles; internal combustion engines; modules; packaging; power electronics; printed circuits; stability; vibrations; PCB; automotive electronic control unit; cars installation; combustion engine; cooling concept; electric motor; electromobility application; electronic component integration; engine compartment; exhaust gas emission; green mobility drive OEM; hybrid electric vehicle; hybrid electronic vehicle; oil consumption; packaging technology; politic regulation; power electronics; power module; temperatu stability; vibrational robust design; Consumer electronics; Cooling; Engines; Multichip modules; Power electronics; Supply chains; Vehicles; Embedded and Miniature Passives; High Temperature Packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electric Drives Production Conference (EDPC), 2012 2nd International
Conference_Location :
Nuremberg
Print_ISBN :
978-1-4673-3007-7
Type :
conf
DOI :
10.1109/EDPC.2012.6425104
Filename :
6425104
Link To Document :
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