DocumentCode :
3149750
Title :
Development of back junction point contact photovoltaic cells and arrays for space
Author :
Garboushian, V. ; Turner, G. ; Yoon, S. ; Vendura, G.J., Jr.
Author_Institution :
AMONIX Inc., Torrance, CA, USA
fYear :
1996
fDate :
13-17 May 1996
Firstpage :
227
Lastpage :
230
Abstract :
This paper presents the results of a project to develop back-junction, point-contact silicon solar cells and modules for space. Such cells are already fabricated commercially for terrestrial applications using standardized equipment and processes originally developed for high manufacturing throughput, low-cost semiconductor chip technologies. Individual 2 cm×2 cm cell outputs of 18%, AM0 are routinely obtained. Since all contacting takes place at the back surface, very high packing densities are possible resulting in comparatively higher output for arrays. The present study is divided into three phases: (1) development of individual cells into a space product, (2) development of rigid and flexible modules (3) and module fabrication for flight experimentation upon the Small Satellite Technology Initiative (SSTI). The first phase focused upon silicon surface and bulk features to increase photon absorption and reduce recombination. The compatibility of the finished cells with space worthy components such as interconnects and coverglasses was confirmed. In the next phase, cells were assembled into small modules. Substrate material included both rigid, 8 mil, silicon wafers as well as flexible, 1 mil Kapton. An interconnection system was developed which consisted of redundant thin-film metal patterns deposited directly on the substrate surfaces. This was followed by a solder reflow bonding process compatible with high volume robotic fabrication equipment. This effort resulted in the fabrication and testing of two SSTI flight modules consisting of a series arrangement of nine 2 cm×2 cm cells each
Keywords :
electrical contacts; elemental semiconductors; photovoltaic power systems; reflow soldering; semiconductor device metallisation; semiconductor device packaging; silicon; solar cell arrays; solar cells; space vehicle power plants; 18 percent; 2 cm; Kapton; Si; Small Satellite Technology Initiative; back junction point contact photovoltaic cells; back surface contact; coverglasses; flexible modules; flight experimentation; high packing densities; interconnects; module fabrication; photon absorption; recombination reduction; redundant thin-film metal patterns deposition; rigid modules; robotic fabrication equipment; silicon solar cells; solar cell arrays; solder reflow bonding; substrate material; Absorption; Fabrication; Manufacturing processes; Photovoltaic cells; Satellites; Semiconductor device manufacture; Silicon; Space technology; Substrates; Throughput;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialists Conference, 1996., Conference Record of the Twenty Fifth IEEE
Conference_Location :
Washington, DC
ISSN :
0160-8371
Print_ISBN :
0-7803-3166-4
Type :
conf
DOI :
10.1109/PVSC.1996.563988
Filename :
563988
Link To Document :
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