DocumentCode :
3149962
Title :
Integrate Collaborative Project and Intellectual Asset Management for IC Design Industry
Author :
Hsiao, David W. ; Trappey, Amy JC ; Ma, Lin ; Ho, Pei-Shun
Author_Institution :
Nat. Tsing Hua Univ., Hsinchu
fYear :
2007
fDate :
26-28 April 2007
Firstpage :
703
Lastpage :
708
Abstract :
Owning to the rapid growth of consumer electronics market, there are urgent needs for better control over IC design projects, reuses of design knowledge (e.g., silicon intellectual property - SIP), and design collaboration in a virtual design platform. In order to provide IC industry a well-integrated design environment, this research proposes an information platform which combines the project management module, the design knowledge management module and the collaborative working environment for the IC industry. With the help of the project management module, the R&D team leaders can better control its partners´ and its own schedules to shorten the time to market. Moreover, the design knowledge (SIP) management module provides the IC companies and their partners a knowledge exchange environment to enrich the design chain productivity and efficiency. Finally, the integration of collaborative working environment is the propeller to enable collaborative design. With the collaborative project and knowledge management platform, IC companies gain competitive advantages when working as a virtual design team.
Keywords :
circuit CAD; electronics industry; groupware; industrial property; integrated circuit design; knowledge management; research and development management; IC design industry; R&D team leaders; collaborative working environment; consumer electronics market; design collaboration; design knowledge management; integrate collaborative project management; integrated design environment; intellectual asset management; knowledge exchange environment; virtual design platform; Asset management; Collaboration; Collaborative work; Consumer electronics; Intellectual property; Job shop scheduling; Knowledge management; Project management; Silicon; Time to market; Collaborative Product Design; IC design; Knowledge Management; Project Management; SIP;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Supported Cooperative Work in Design, 2007. CSCWD 2007. 11th International Conference on
Conference_Location :
Melbourne, Vic.
Print_ISBN :
1-4244-0963-2
Electronic_ISBN :
1-4244-0963-2
Type :
conf
DOI :
10.1109/CSCWD.2007.4281522
Filename :
4281522
Link To Document :
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