DocumentCode :
3151258
Title :
Dielectric and piezoelectric properties of stacked and plated PVDF, P(VDF/TeFe), P(VDF/TrFE) and ceramic/rubber composite thick films
Author :
Bloomfield, Philip E.
Author_Institution :
Biomed. Eng. & Sci. Inst., Drexel Univ., Philadelphia, PA, USA
fYear :
1991
fDate :
33457
Firstpage :
287
Lastpage :
290
Abstract :
We measured the properties of nine different piezoelectric materials, as supplied, and as further processed to increase their hydrostatic sensitivity. We studied the effect of electrode material, stiffening plates, and multiple layering on the piezoelectric and dielectric properties of the thick piezopolymer films. Dielectric measurements and thickness mode d3t, lateral mode d31 (d32), and hydrostatic mode dh piezoelectric coefficients were measured at different stages of the films´ processing into layered stacks. The polymer films were bonded together to produce two-layer and three-layer thick films. Metal stiffening plates bonded to the films´ outside surfaces inhibit lateral response and hence improve hydrostatic voltage response. The highest sensitivities result from the thickest P(VDF/TrFE) samples with the lowest dielectric constants and stiffest clamping plates
Keywords :
composite materials; dielectric losses; permittivity; piezoceramics; piezoelectric materials; polymer films; rubber; P(VDF/TeFe); P(VDF/TrFE); ceramic/rubber composite thick films; clamping plates; dielectric constants; dielectric properties; electrode material; hydrostatic mode; hydrostatic sensitivity; hydrostatic voltage response; lateral mode; lateral response; multiple layering; piezoelectric properties; piezopolymer films; plated PVDF; stacked PVDF; stiffening plates; thickness mode; Bonding; Dielectric materials; Dielectric measurements; Electrodes; Piezoelectric films; Piezoelectric materials; Polymer films; Response surface methodology; Thick films; Thickness measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applications of Ferroelectrics, 1994.ISAF '94., Proceedings of the Ninth IEEE International Symposium on
Conference_Location :
University Park, PA
Print_ISBN :
0-7803-1847-1
Type :
conf
DOI :
10.1109/ISAF.1994.522360
Filename :
522360
Link To Document :
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