DocumentCode :
3151649
Title :
High-gain submillimeter-wave mHEMT amplifier MMICs
Author :
Tessmann, A. ; Leuther, A. ; Massler, Hermann ; Hurm, V. ; Kuri, M. ; Zink, M. ; Riessle, M. ; Lösch, R.
Author_Institution :
Fraunhofer Inst. for Appl. Solid State Phys. (IAF), Freiburg, Germany
fYear :
2010
fDate :
23-28 May 2010
Firstpage :
53
Lastpage :
56
Abstract :
A compact H-band (220-325 GHz) submillimeter-wave monolithic integrated circuit (S-MMIC) amplifier has been developed, based on a grounded coplanar waveguide (GCPW) technology utilizing 50 nm and 35 nm metamorphic high electron mobility transistors (mHEMTs). By applying the 35 nm gate-length process, a four-stage cascode amplifier circuit achieved a small-signal gain of 26 dB at 320 GHz and more than 20 dB in the bandwidth from 220 to 320 GHz. Based on the 50 nm mHEMT technology, the same amplifier design demonstrated a linear gain of 19.5 dB at 320 GHz and more than 15 dB between 240 and 320 GHz. Coplanar topology in combination with cascode transistors resulted in a very compact die size of only 0.6 mm2. For low-loss packaging of the circuit, a set of waveguide-to-microstrip transitions has been realized on 50 μm thick GaAs and quartz substrates demonstrating an insertion loss S21 of less than 2 dB and 1.25 dB at 320 GHz, respectively. Finally, successful mounting and packaging of the amplifier chip into an H-band waveguide module was accomplished with only minor reduction in performance.
Keywords :
MMIC amplifiers; coplanar waveguides; high electron mobility transistors; microstrip transitions; submillimetre wave amplifiers; GCPW technology; H-band waveguide module; S-MMIC amplifier; amplifier chip; cascode amplifier circuit; cascode transistors; compact H-band submillimeter-wave monolithic integrated circuit amplifier; coplanar topology; gate-length process; grounded coplanar waveguide technology; high-gain submillimeter-wave mHEMT amplifier; insertion loss; low-loss packaging; metamorphic high electron mobility transistors; quartz substrates; waveguide-to-microstrip transitions; Coplanar waveguides; Gain; HEMTs; Integrated circuit technology; MMICs; Monolithic integrated circuits; Packaging; Submillimeter wave integrated circuits; Submillimeter wave technology; mHEMTs; H-band; grounded coplanar waveguide (GCPW); high-gain amplifier; metamorphic high electron mobility transistor (mHEMT); submillimeter-wave monolithic integrated circuit (S-MMIC); waveguide-to-microstrip transition;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest (MTT), 2010 IEEE MTT-S International
Conference_Location :
Anaheim, CA
ISSN :
0149-645X
Print_ISBN :
978-1-4244-6056-4
Electronic_ISBN :
0149-645X
Type :
conf
DOI :
10.1109/MWSYM.2010.5518016
Filename :
5518016
Link To Document :
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