DocumentCode :
3151909
Title :
Effects of curing condition on properties and microstructure of latex-modified cement mortars
Author :
Han, Ying ; Zhao, Wenjie
Author_Institution :
Sch. of Mater. Sci. & Eng., Jilin Inst. of Archit. Eng., Changchun, China
fYear :
2011
fDate :
16-18 April 2011
Firstpage :
3128
Lastpage :
3131
Abstract :
Polybutadiene-graft-polystyrene (PB-g-PS) latex with a core-shell weight ratio of 50/50 was used to modify cement mortar. In the constant water-cement ratio of 0.5, and curing 24h at 20 °C, RH90% air followed using two curing methods (6d immersed in 20°C water followed by 21d at 20°C, RH 65%air or 27d at 20°Cwater). At the different polymer-cement weight ratios (P/C), polymer-modified mortars (PMMs) were prepared, and tested to flow, compressive and flexural strengths and water absorption rate. Scanning electric microscope (SEM) was used to investigate the microstructure of PMMs. On the basis of the test results, effect of the curing condition on the properties and microstructure of modified-mortars were discussed. It is concluded that PB-g-PS core-shell latex can be incorporated into cement as modifier.
Keywords :
bending strength; cement industry; cements (building materials); compressive strength; curing; polymer blends; shells (structures); PB-g-PS core shell latex; compressive strengths; core shell weight ratio; curing condition effect; flexural strengths; latex modified cement mortar; polybutadiene graft polystyrene latex; polymer cement weight ratio; polymer modified mortar; scanning electric microscope; temperature 20 degC; time 21 d; time 24 hour; time 27 d; water absorption rate; water cement ratio; Absorption; Curing; Educational institutions; Microstructure; Mortar; Polymers; PB-g-PS core-shell structure latex; curing condition; microstructure; modified cement mortars; property;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Consumer Electronics, Communications and Networks (CECNet), 2011 International Conference on
Conference_Location :
XianNing
Print_ISBN :
978-1-61284-458-9
Type :
conf
DOI :
10.1109/CECNET.2011.5768414
Filename :
5768414
Link To Document :
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