DocumentCode :
3151914
Title :
Ultrasonic piezoceramic-polymer composite transducer-dynamic behavior and effects of heterogeneous structure
Author :
Zhang, Q.M. ; Geng, X. ; Shui, Y. ; Cao, Wenwu ; Cross, L.E.
Author_Institution :
Mater. Res. Lab., Pennsylvania State Univ., University Park, PA, USA
fYear :
1991
fDate :
33457
Firstpage :
329
Lastpage :
332
Abstract :
A dynamic theory is developed for piezocomposites with 2-2 connectivity. By solving the coupled dynamic equations in the piezoceramic plate and polymer region subjected to the boundary conditions at the ceramic-polymer interface, the distributions of the elastic and electric variables in a composite are obtained. The electromechanical coupling factor, the acoustic impedance, the resonant frequency, and the elastic coupling between the polymer and ceramic at the thickness resonance can be determined. The effects of mode coupling on the thickness resonance and lateral resonance are elucidated and the dependence of the frequency of these resonant modes on the composite thickness can be estimated. Theoretical results are compared with experimental observations
Keywords :
acoustic impedance; composite material interfaces; electromechanical effects; filled polymers; piezoceramics; piezoelectric transducers; ultrasonic transducers; 2-2 connectivity; acoustic impedance; boundary conditions; ceramic-polymer interface; composite thickness; coupled dynamic equations; dynamic behavior; dynamic theory; elastic coupling; elastic variables; electric variables; electromechanical coupling factor; heterogeneous structure; lateral resonance; mode coupling; piezoceramic plate; piezocomposites; polymer region; resonant frequency; thickness resonance; ultrasonic piezoceramic-polymer composite transducer; Boundary conditions; Ceramics; Electric variables; Equations; Frequency estimation; Impedance; Piezoelectric materials; Polymers; Resonance; Resonant frequency;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applications of Ferroelectrics, 1994.ISAF '94., Proceedings of the Ninth IEEE International Symposium on
Conference_Location :
University Park, PA
Print_ISBN :
0-7803-1847-1
Type :
conf
DOI :
10.1109/ISAF.1994.522369
Filename :
522369
Link To Document :
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