Evaluation of TSV and micro-bump probing for wide I/O testing

Author

Smith, Ken ; Hanaway, Peter ; Jolley, Mike ; Gleason, Reed ; Strid, Eric ; Daenen, Tom ; Dupas, Luc ; Knuts, Bruno ; Marinissen, Erik Jan ; Van Dievel, Marc

Author_Institution

Cascade Microtech, Inc., Beaverton, OR, USA

fYear

2011

fDate

20-22 Sept. 2011

Firstpage

1

Lastpage

10

Abstract

Practical silicon stacking requires pre-tested dies, but contact probing of TSV interconnects requires much higher density, lower probing forces, and lower cost per pin than conventional probe cards have achieved. This paper examines a cost-effective, lithographic-based MEMS probe card technology that is suitable for probing 40μm pitch arrays, and scalable to finer pitches. Initial mechanical and electrical results are presented, demonstrating the feasibility of probing large arrays at 1 gram-force per tip with very low pad damage, so as not to impair downstream bonding or other processing steps.

Keywords

integrated circuit interconnections; integrated circuit testing; micromechanical devices; photolithography; probes; three-dimensional integrated circuits; I/O testing; TSV evaluation; TSV interconnects; contact probing; lithographic-based MEMS probe card technology; microbump probing; pitch array probing; probe cards; silicon stacking; Contact resistance; Copper; Electrical resistance measurement; Force; Pollution measurement; Probes; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Conference (ITC), 2011 IEEE International

Conference_Location

Anaheim, CA

ISSN

1089-3539

Print_ISBN

978-1-4577-0153-5

Type

conf

DOI

10.1109/TEST.2011.6139180

Filename

6139180