Title :
Time-based machine-process grouping
Author :
Sheu, D. Daniel ; Cheng, Chao-En
Author_Institution :
Dept. of Ind. Eng. & Eng. Manage., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Abstract :
The quality of manufacturing design has fundamental impacts on the production performance. In designing manufacturing cells, people often apply group technology to group the parts into the different machine families and/or parts families based on product or process features. This often relies on individual´s experience and qualitative logical analysis. The results can be subjective and arbitrary. However, major impacts by machine/process grouping are often on the overall cycle time and throughput due to set-up/change-over losses. This research proposed a time-based machine/process grouping method based on similarity concept and set-up/change-over times. A dendrogram is used to group the processes and machines. An Excel-based grouping program is established to automate the objective quantitative process ready for engineers to use. Using data from a real semiconductor fabrication plant, simulation models were used to test the performance of the proposed grouping technique. First-in-first-out and critical ratio dispatching rules were experimented. The results show that the proposed grouping technique has far better performance than the existing grouping and two other comparative methods in throughput, average cycle time, average WIP (work in process), delivery rate and move.
Keywords :
cellular manufacturing; group technology; product design; production engineering computing; production equipment; Excel-based grouping program; critical ratio dispatching rule; dendrogram; first-in-first-out dispatching; group technology; machine families; manufacturing cells; manufacturing design; parts families; production performance; qualitative logical analysis; semiconductor fabrication plant; set-up/change-over losses; time-based machine-process grouping; work in process; Dispatching; Fabrication; Group technology; Manufacturing processes; Production; Semiconductor device testing; Throughput; dendogram; group technology; manufacturing cell design;
Conference_Titel :
Computers & Industrial Engineering, 2009. CIE 2009. International Conference on
Conference_Location :
Troyes
Print_ISBN :
978-1-4244-4135-8
Electronic_ISBN :
978-1-4244-4136-5
DOI :
10.1109/ICCIE.2009.5223735