DocumentCode :
3152607
Title :
The gap: Test challenges in Asia manufacturing field
Author :
Gu, Xinli
Author_Institution :
Huawei
fYear :
2011
fDate :
20-22 Sept. 2011
Firstpage :
1
Lastpage :
1
Abstract :
Today, more and more electronic manufacturing is being done in Asia. Test, as one of the important functions of manufacturing, is critical to guarantee the product quality and as a monitor of the manufacturing process. Through presenting the gap between the test challenges the Asia companies are facing and the tools they have today, we hope give the ITC community an opportunity to better understand the needs of innovation for test technologies and tools. This panel invites speakers from companies in Asia to present their test challenges and current solutions. It covers both design for test challenges and the complexities of the production test challenges. The focus is on the gap between what they need with today´s challenges and the current capabilities.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Conference (ITC), 2011 IEEE International
Conference_Location :
Anaheim, CA, USA
ISSN :
1089-3539
Print_ISBN :
978-1-4577-0153-5
Type :
conf
DOI :
10.1109/TEST.2011.6139195
Filename :
6139195
Link To Document :
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